The EC-C1200 inverter has two main temperature measurements which govern the behavior and temperature trips (limits) of the device: junction temperature and baseplate temperature.
The estimated maximum IGBT junction temperature is a calculated value which estimates the hotspot temperature of the power transistors. The trip limit of this temperature is 175 °C. Before this temperature, the thermal model begins to limit (derate) the maximum available inverter current when the estimated junction temperature rises above 150 °C. Junction temperature is mostly affected by the actual current flowing through the inverter, and should be below 150 degrees with nominal inverter current (350 A RMS).
The inverter may also trip based on the measured IGBT cooling plate temperature (a.k.a. baseplate temperature). The temperature trip limit for the baseplate measurement is 110 °C. Typically this trip occurs if there is insufficient cooling and the inverter load is very small, causing the junction temperature to stay within the allowed limits while the baseplate and coolant slowly heat up. Baseplate measurement should be approximately 10 - 30 °C higher than coolant temperature with inverter nominal current.
It is common for air to get trapped in the inverter cooling channel, especially when the inverter is installed upright (cables are leaving the inverter directly towards the ground). In this case, the air should be flushed out of the inverter with a higher coolant flow and/or removing the inverter from its mounting and laying it flat on a surface to allow air to escape the channel, and then reinstall the inverter to its mounting place.